is multi-layer flexible printed circuit board with nearly unlimited
Design possible.
Multilayer flexible printed circuits (FPCs) have up to eight layers to route out HDI
(High Density Interconnect) areas. The high layer count is reduced partially to create
flexible areas. Flexibility can be further increased by forming an air gap build-up.
Features
100% Polyimide material construction provides greater thermal reliability than our competitor’s multilayered circuits.
This functional integration of the flex cable and rigid board eliminates connectors and saves space.
Basic structure
Base Material
Polyimide film
25μm(1mil)、12.5μm(1/2mil)
Cu
17.5μm(1/2oz)、12μm(1/3oz))
Cover Material
Polyimide film
25μm(1mil)、12.5μm(1/2mil)
Resist ー
Via
Through Hole 0.20mm~ IVH 0.15mm~、SVH 0.10mm~
Surface treatment
Gold Plating、OSP、Solder Plating
Layers
3 to 8 layers
Special structure 1 【4C1B】
※These structures are just examples. More appropriate structures can be provided at your request. Please consult with us individually.
Special structure 2 【2C2B】
※These structures are just examples. More appropriate structures can be provided at your request. Please consult with us individually.