Consists of double-sided copper clad material with top and bottom cover films .
Two conductive layers with an insulating layer between, plus cover layers on outer layer.
Two conductive layer are connected electrically via plated through holes or plated microvias.
Allows for more intricate circuit designs than a single-sided FPC.
Further space savings are realized by mounting components on both sides of the FPC.
Solder Electrolytic Plating
Gold Electrolytic Plating